Quality Control for Electronic Products: Implementation of a Burn-In Test for Printed Circuit Boards

Abstract

The production process of Printed Circuit Boards (PCBs) for projects that require high quality standards demands a robust Quality Control System. A product may undergo several qualification levels, with rigorous testing and high certification, and still present failures in the field, compromising customer satisfaction and, consequently, brand reputation. Considering that electronic components tend to exhibit a high probability of failure in the early stages of their useful life, this work aims to implement a Thermal Stress Screening Test Plan (Burn-in) for PCBs, anticipating the manifestation of latent defects before the product is deployed in the field, selecting those with greater durability without compromising their useful life. This test plan, necessary for implementation, must define test conditions, techniques, infrastructure, acceptance criteria, data collection procedures, and data analysis methods to ensure test standardization and reproducibility.